Complete Overview of Electronic Circuit Board Level Underfill Material Market: (2017-2027)
Press Release – 16 Jan 2019 Research and Development News -- . . Latest Update "Electronic Circuit Board Level Underfill Material Market: Global Industry Analysis (2012-2016) and Opportunity Assessment (2017-2027)" with Industries Survey | Global Current Growth and Future. ' ' “ Owing to increasing number and use of electronics products, the demand for board level underfill material is expected to increase in the coming years” The development of underfill technology is driven by the advances of the flip-chip technology and are generally epoxies that are loaded with a filler such as silica. Underfill materials offer stress relieving to solder joints, extend thermal aging and lifetime of device. Underfill technology is used to distribute and redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. These underfill are made from different materials such as epoxy,