Global Market Research Group

Albany, New York, Jan 17,2017 "Global Chip Mounter Market 2016-2020" The Report covers current Industries Trends, Worldwide Analysis, Global Forecast, Review, Share, Size, Growth, Effect. Description- The chip mounting technology has progressed significantly over the last two decades in terms of a practical solution for achieving higher densities related to packaging systems. It started with the conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly consists of a silicon-based die or integrated circuits chips, which got reduced to