Complete Overview of Electronic Circuit Board Level Underfill Material Market: (2017-2027)
Press Release – 16
Jan 2019
Research
and Development News
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Latest
Update
"Electronic Circuit Board Level Underfill Material Market:
Global Industry Analysis (2012-2016) and Opportunity Assessment
(2017-2027)"
with Industries Survey | Global Current Growth and Future.
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“Owing to increasing number and use of
electronics products, the demand for board level underfill material
is expected to increase in the coming years”
The development of underfill technology is driven by the advances of the flip-chip technology and are generally epoxies that are loaded with a filler such as silica. Underfill materials offer stress relieving to solder joints, extend thermal aging and lifetime of device. Underfill technology is used to distribute and redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. These underfill are made from different materials such as epoxy, silica, alumina, urethane and many others.
The development of underfill technology is driven by the advances of the flip-chip technology and are generally epoxies that are loaded with a filler such as silica. Underfill materials offer stress relieving to solder joints, extend thermal aging and lifetime of device. Underfill technology is used to distribute and redistribute the thermo-mechanical stress created by the Coefficient of Thermal Expansion (CTE) mismatch between the silicon chip and organic substrate. These underfill are made from different materials such as epoxy, silica, alumina, urethane and many others.
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A detailed
analysis on the electronic circuit board level underfill material
market. This analysis includes segment wise intelligence, regional
intelligence, competitive intelligence as well as weightage on
trends, opportunities, drivers and restraints that have influence on
the growth of the global market for electronic circuit board level
underfill material. According to the acumen gleaned by Future Market
Insights, the global electronic circuit board level underfill
material is anticipated to grow at a high rate during the assessment
period.
During
the 2012-2016 timeline, the global electronic circuit board level
underfill material market reflected a comparatively slow growth rate,
but it is projected to grow at a CAGR of 5.7% throughout the
2017-2027 timeline. In 2017, it is valued at around US$ 255 Mn and is
estimated to reach a value of more than US$ 440 Mn by the end of the
year of assessment. The main aspects contributing to the growth of
the global electronic circuit board level underfill material market
include increasing demand for smartphones, growth in consumer
electronics sector, growing investments in electronics sector and
increasing focus on electronics miniaturization..
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“Underfill
segment to maintain status quo throughout the period of
assessment”
The underfill segment in the product type category is anticipated to grow at a significant pace in the coming years. This segment reflected a higher market share since past years and dominated the global market during the 2012-2016 timeline. It is likely to continue with this trend in the coming years and maintain its status quo. In 2017, this segment reflected a value of around US$ 147 Mn thus leading the global market. By the end of the year of assessment, this segment is poised to slate a value of more than US$ 260 Mn. The underfill segment is projected to grow at a high value CAGR throughout the forecast period as it is a preferred technology and has a high demand in the flip chips board type. This is the most lucrative segment from both revenue share ad growth perspectives.
“Electronic Circuit Board Level Underfill Material Market”
The underfill segment in the product type category is anticipated to grow at a significant pace in the coming years. This segment reflected a higher market share since past years and dominated the global market during the 2012-2016 timeline. It is likely to continue with this trend in the coming years and maintain its status quo. In 2017, this segment reflected a value of around US$ 147 Mn thus leading the global market. By the end of the year of assessment, this segment is poised to slate a value of more than US$ 260 Mn. The underfill segment is projected to grow at a high value CAGR throughout the forecast period as it is a preferred technology and has a high demand in the flip chips board type. This is the most lucrative segment from both revenue share ad growth perspectives.
“Electronic Circuit Board Level Underfill Material Market”
- Edge bonds to significantly contribute to the growth of the underfill segment
Underfill segment is further categorized into edge bonds and capillary fills sub segments. Of these, the edge bonds sub segment is expected to largely contribute to the market share of the parent segment. This sub segment is estimated to reach valuation of about US$ 165 Mn growing at a high value CAGR of 6.9% during the forecast period. Edge bonds technology is expected to be growing at this high CAGR owing to their low cost, fast processing and better rework ability. Edge/Corner bonding improves the mechanical reliability performance of the board. The capillary fills sub segment is projected to grow at a relatively slow value CAGR of 4.4% during the said period.
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