Global Chip-on-flex (COF) Top Market Review and Current Demand 2017-2021
"Global
Chip-on-flex (COF) Market 2017-2021"
The Report covers current Industries Trends, Worldwide Analysis,
Global Forecast, Review, Share, Size, Growth, Effect.
Description-
About
Chip-on-flex
COF is a type of chip-on-board (COB) process technology. The fundamentals of the COB process involve attaching die or a chip in place and wire bonding it directly to the substrate metallization, alongside other surface mount devices (SMD) attached by standard surface mount technology (SMT) processes. The process significantly improves lead time, footprint efficiency, and is affordable.
COF is a type of chip-on-board (COB) process technology. The fundamentals of the COB process involve attaching die or a chip in place and wire bonding it directly to the substrate metallization, alongside other surface mount devices (SMD) attached by standard surface mount technology (SMT) processes. The process significantly improves lead time, footprint efficiency, and is affordable.
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Technavios
analysts forecast the global chip-on-flex market to grow at a CAGR of
4.42% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global chip-on-flex market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
The market is divided into the following segments based on geography:
Americas
APAC
EMEA
Technavio's report, Global Chip-on-flex Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
FLEXCEED Co., Ltd.
Finetech
SHENZHEN DANBOND TECHNOLOGY CO., LTD.
AKM Industrial
Other prominent vendors
Compunetix
Stars Microelectronics
Compass Technology
Market driver
Increased R&D investments in flexible displays market
For a full, detailed list, view our report
Market challenge
Lag in mass production of flexible OLED displays
For a full, detailed list, view our report
Market trend
Increasing vertical integration
For a full, detailed list, view our report
Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
Covered in this report
The report covers the present scenario and the growth prospects of the global chip-on-flex market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
The market is divided into the following segments based on geography:
Americas
APAC
EMEA
Technavio's report, Global Chip-on-flex Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
FLEXCEED Co., Ltd.
Finetech
SHENZHEN DANBOND TECHNOLOGY CO., LTD.
AKM Industrial
Other prominent vendors
Compunetix
Stars Microelectronics
Compass Technology
Market driver
Increased R&D investments in flexible displays market
For a full, detailed list, view our report
Market challenge
Lag in mass production of flexible OLED displays
For a full, detailed list, view our report
Market trend
Increasing vertical integration
For a full, detailed list, view our report
Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
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