System-in-Package (SiP) Die Technologies In-Depth Industrial and Market studies - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2016 - 2019
Albany, New York, Jan 23,2017
"System-in-Package
(SiP) Die Technologies Market - Global Industry Analysis, Size,
Share, Growth, Trends and Forecast, 2016 - 2019"
The Report covers current Industries Trends, Worldwide Analysis,
Global Forecast, Review, Share, Size, Growth, Effect.
Description-
System
in a Package (SiP) technology created multiple enhanced packaging
applications to develop solutions that are capable of being
customized depending on the requirement of the user. SiP is a
combination of several integrated circuits (ICs) combined in a single
module or package. System in a Package gives tangible gains when
space reduction is considered. Although system-on-chip (SoC) fulfills
the same objective further effectively, their designs are more time
consuming and complex than system in a package. SiP\'s simplicity has
unbolted a wide collection of uses for it in not less than 10 years
since its origin. ICs in System in package are interconnected to each
other to form a single integrated unit. Wire bond technology and flip
chip technology are the two main technologies used to interconnect
the chips in system in a package.
Low
cost of ownership is one of the major driving forces for the
system-in-a-package market. Other factors driving the market growth
include low cost required for development higher levels of
integration, increased functionality with smaller size (as compared
to separately packaged ICs) and better flexibility in product
development. Also, rising demand for high performance and
miniaturized electronic devices and high penetration in consumer
electronics segment is expected to drive the systems in a package
market. However, factors such as limited availability of resources
and skills, re-alignment of electronic decision automation (EDA)
processes and lack of known good die (KGD) are hampering the growth
of the system in package market.
The
system in package market is segmented on the basis of applications
into consumer electronics sector, communications sector, automotive &
transportation sector, industrial sector, military, defense &
aerospace (MDA) and medical sector among others. On the basis of end
use, the market is segmented into RF wireless modules, high power
communication devices, power amplifiers, led packages, servers, high
density single module computers, portable electronics, space and
military avionics and wearable computers. In addition, the systems in
a package market is segmented on the basis of packaging technology
into 3D IC packaging, 2.5D IC packaging and 2D IC packaging
technology. The packaged chips or bare die are horizontally tiled in
2.5D or 2D technology; the only difference lies in the 2.5D IC. A
silicon interposer is placed between the substrate and die in 2.5D IC
while in 3D IC packaging, the packaged IC or the bare die are mounded
vertically to form SiP.
Furthermore,
the system in a package market is segmented on the basis of packaging
type into BGA (ball grid array), pin grid array (PGA), surface mount
package, small outline package (SOP) and flat package. Ball grid
array is further sub-segmented into plastic ball grid array (PBGA),
small ball grid array (SBGA), flip chip molded ball grid array
(FCBGA) and fine ball grid array (FBGA). PGA is further sub segmented
into flip chip molded pin grid array (FCPGA) and ceramic pin grid
array (CPGA). Flat packages comprise of quad flat no leads (QFN) and
ultra thin quad flat no leads (UTQFN) and small outline packages sub
divisions are thin small outline packages (TSOP) and thin shrink
small outline packages (TSSOP).
Some
of the key players in the systems in a package market include Amkor
Technology Inc., Chipmos Tech. Inc, ASE Inc., Chipbond Technology
Corporation, GS Nanotech, Fujitsu Ltd., Insight SIP, Nanium S.A.,
Jiangsu Changjiang Electronics Technology Co. Ltd, Qualcomm
Incorporated, Powertech Technologies Inc., Stats Chippac Ltd.,
Siliconware Precision Industries Co. Ltd., WI2WI Corporation and
Toshiba Corporation among others.
–
This research report analyzes this market depending on its
market segments, major geographies, and current market trends.
Geographies analyzed under this research report include
- North America
- Asia Pacific
- Europe
- Rest of the World
– This
report provides comprehensive analysis of
- Market growth drivers
- Factors limiting market growth
- Current market trends
- Market structure
- Market projections for upcoming years
This
report is a complete study of current trends in the market, industry
growth drivers, and restraints. It provides market projections for
the coming years. It includes analysis of recent developments in
technology, Porter’s five force model analysis and detailed
profiles of top industry players. The report also includes a review
of micro and macro factors essential for the existing market players
and new entrants along with detailed value chain analysis.
–
Reasons for Buying this Report
- This report provides pin-point analysis for changing competitive dynamics
- It provides a forward looking perspective on different factors driving or restraining market growth
- It provides a six-year forecast assessed on the basis of how the market is predicted to grow
- It helps in understanding the key product segments and their future
- It provides pin point analysis of changing competition dynamics and keeps you ahead of competitors
- It helps in making informed business decisions by having complete insights of market and by making in-depth analysis of market segments
- It provides distinctive graphics and exemplified SWOT analysis of major market segments
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