Global Chip Mounter In-Depth Industrial and Market studies 2016-2020
Albany, New York, Jan 17,2017
"Global
Chip Mounter Market 2016-2020"
The Report covers current Industries Trends, Worldwide Analysis,
Global Forecast, Review, Share, Size, Growth, Effect.
Description-
The
chip mounting technology has progressed significantly over the last
two decades in terms of a practical solution for achieving higher
densities related to packaging systems. It started with the
conventional through hole technology (THT), then resurfaced as
surface mount technology (SMT) and fine pitch technology (FPT). Most
manufacturers are using both SMT and THT to produce chips mounted on
substrates. The dynamic semiconductor packaging technology has
evolved with the help of THT (with component steers through 2.54 mm
hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized
centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The
component package mainly consists of a silicon-based die or
integrated circuits chips, which got reduced to a large extent within
the last two decades. Thus, the chip mounting technology has moved
from a big diameter to a small diameter of space.
*
Technavios analysts forecast the global chip mounter market to grow
at a CAGR of 8.05% during the period 2016-2020.
–
Covered
in this report
The
report covers the present scenario and the growth prospects of the
global chip mounter market for 2016-2020. To calculate the market
size, the report considers revenue from the sales of chip mounter
equipment.
–
The
market is divided into the following segments based on geography:
Americas
APAC
EMEA
Technavio's
report, Global Chip Mounter Market 2016-2020, has been prepared based
on an in-depth market analysis with inputs from industry experts. The
report covers the market landscape and its growth prospects over the
coming years. The report also includes a discussion of the key
vendors operating in this market.
–
Key
vendors
Hitachi
Juki
Corporation
Nitto
Denko Corporation
Panasonic
Yamaha
Corporation
–
Other
prominent vendors
ASM
Pacific Technology
Canon
Essemtec
Ohashi
Engineering
Nordson
Samsung
Techwin
Sony
Sun
Electric Industries
TOA
–
Market
driver
Growing
adoption of communication-related consumer electronic gadgets
For
a full, detailed list, view our report
–
Market
challenge
Uncertain
global economic conditions
For
a full, detailed list, view our report
–
Market
trend
Emergence
of wearable technology
For
a full, detailed list, view our report
–
Key
questions answered in this report
What
will the market size be in 2020 and what will the growth rate be?
What
are the key market trends?
What
is driving this market?
What
are the challenges to market growth?
Who
are the key vendors in this market space?
What
are the market opportunities and threats faced by the key vendors?
What
are the strengths and weaknesses of the key vendors?
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